Green Surface Treatment for Semiconductor Parts

Key Features：

• Integrates chemical cleaning, clean rinsing, and drying into one system.

• Removes excess metallic elements from the product surface

• Eliminates organic contaminants and residues through ultrasonic cleaning combined with organic reagents.

• Removes fine particles using mechanical scrubbing combined with ultrasonic rinsing.

• Supports a front–rear segmented configuration: the rear section can be installed in a cleanroom to ensure shipment cleanliness.

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➢ Applicable Fields：

Silicon / Silicon Carbide Parts, Quartz Parts, Ceramic Parts, Metal Parts, Plastic

Parts, Etc.