Ultra-Clean Cleaning Advanced Technology

An ultra-clean cleaning system that integrates ultrasonic cleaning, ultrasonic fine cleaning, and vacuum drying into a single solution.

By combining ultrasonic cleaning with DIW (deionized water) and organic solvent rinsing, the system effectively removes organic contaminants and adhered residues from product surfaces.

Using purely physical methods, it applies mechanical scrubbing together with MegaSonic rinsing technology to eliminate micron- and submicron-level particles from product surfaces.

Chemical cleaning refers to the use of various chemical reagents and organic solvents to react with or dissolve contaminants and dust adsorbed on the surface of the object being cleaned. It may be combined with ultrasonics, heating, megasonics, vacuum processing, or other auxiliary methods to promote the desorption (detachment) of impurities from the surface. Afterward, the surface is thoroughly rinsed with a large volume of high-purity hot or cold deionized water, resulting in a clean surface.

Chemical cleaning can be divided into wet cleaning and dry cleaning. Among these, wet cleaning technology still plays a dominant role in silicon wafer surface cleaning.

At present, the industry is largely based on RCA cleaning, and there is a large amount of literature available online, including academic papers, patents, and technical references from various sources.