Machining & Stamping Cleaning Machine

Plasma Activation Machine (Before Solder Mask Coating)

Application:

• Wire bond pre-treatment: Remove pad contaminants, boost bonding strength & yield\

• Pre-molding: Raise surface energy, strengthen chip-molding compound adhesion, cut voids/delamination

• Pre-underfill: Enhance glue fluidity, reduce filling voids

• Photoresist stripping: Remove residual resist & trim sidewalls

• Surface micro-etching & roughening: Improve inter-material bonding

• Copper oxide reduction: Restore solderability

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Advantages:

• Homogeneous vacuum plasma, consistent & repeatable treatment

• Full coverage for complex geometries, no blind spots\

• Custom tray / drum batch processing options

• Environmentally friendly, pollution-free

• High operational safety

• Modular design for inline production integration