Nano Coating Technology

APPLICATION REQUIREMENT ：

• Dissipates charge and eliminates electrostatic interference.

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CHALLENGES :

• Poor coating adhesion on ceramic, glass and copper components

• High-temperature distortioof precisioaluminium components

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TECHNICAL INNOVATION :

• Proprietary low-temperature ESD nano-material process prevents dimensional deviation in aluminium and other precision parts

• Special multilayer composite process resolves difficult adhesion issues and raises coating quality

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PERFORMANCE :

• Thickness: 2–4 μm; hardness: 1,600–2,500 HV

• Electrical resistance can be controlled from 10⁶ to 10¹⁰ Ω with durable, stable performance and no abrupt fluctuation

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APPLICATIONS :

• Electrostatic and vacuum chucks for semiconductor process and metrology equipment

• Carriers, moulds and fixtures for semiconductor packaging and test equipment

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