Nano Coating Technology

APPLICATION REQUIREMENT ：

• Further improves heat transfer in copper/aluminium thermal components and CPU/GPU cooling modules

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CHALLENGES :

• Gold and silver conduct heat well but are expensive

• Diamond has exceptional conductivity but is costly, requires high processing temperatures and is unsuitable for most metals

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TECHNICAL INNOVATION :

• Proprietary low-temperature deposition works on metal, ceramic and organic-material components and can be applied directly to copper

• Combines high thermal conductivity, exceptional heat dissipation and a degree of wear resistance

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PERFORMANCE :

• Thickness: 500 nm; thermal conductivity: 540 W/m·K; specific heat capacity: 1.65 J/g·K

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APPLICATIONS :

• Fixtures for chip burn-in and chip-on-carrier testing, GPU/CPU cooling assemblies and related applications

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